| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| FEATURES PROVIDED | MONOLITHIC AND DYNAMIC AND W/CLOCK AND HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | CAN |
| INCLOSURE MATERIAL | METAL |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 85.0 CELSIUS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 10 PIN |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MAXIMUM POWER SOURCE |