COMPONENT FUNCTION RELATIONSHIP | MATCHED |
COMPONENT NAME AND QUANTITY | 2 TRANSISTOR |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18 ALL TRANSISTOR |
INTERNAL CONFIGURATION | JUNCTION CONTACT ALL TRANSISTOR |
INTERNAL JUNCTION CONFIGURATION | NPN ALL TRANSISTOR |
INCLOSURE MATERIAL | METAL ALL TRANSISTOR |
POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR |
PROPRIETARY CHARACTERISTICS | PACS |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION ALL TRANSISTOR |
MOUNTING METHOD | TERMINAL ALL TRANSISTOR |
OVERALL DIAMETER | 0.209 INCHES MINIMUM ALL TRANSISTOR AND 0.230 INCHES MAXIMUM ALL TRANSISTOR |
OVERALL LENGTH | 0.185 INCHES MAXIMUM ALL TRANSISTOR |
SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN ALL TRANSISTOR AND 30.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE, DC ALL TRANSISTOR AND 5.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN ALL TRANSISTOR |
TERMINAL CIRCLE DIAMETER | 0.100 INCHES NOMINAL ALL TRANSISTOR |
TERMINAL LENGTH | 0.500 INCHES MINIMUM ALL TRANSISTOR |
TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD ALL TRANSISTOR |