COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE |
INCLOSURE MATERIAL | CERAMIC ALL SEMICONDUCTOR DEVICE DIODE |
MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
TERMINAL TYPE AND QUANTITY | 2 BINDING POST ALL SEMICONDUCTOR DEVICE DIODE |
OVERALL LENGTH | 0.190 INCHES MINIMUM AND |
| 0.210 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
OVERALL DIAMETER | 0.078 INCHES MINIMUM AND |
| 0.084 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
COMPONENT FUNCTION RELATIONSHIP | MATCHED |
FUNCTION FOR WHICH DESIGNED | DETECTOR AND |
| MIXER |
SPECIAL FEATURES | 9.3 GHZ TEST FREQUENCY; 6.5 DECIBEL NOISE FIGURE |